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분석 보고서 - GreenIT

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고 출력, 멀티 칩 LED 벌브에서 방열 거동 해석
출처
대한금속.재료학회
발행일
2018-03-07
분야분류
IT소재부품, 해외동향, 전자정보디바이스, LED, IT부품정보, IT부품정보 네트워크, 부품, GreenIT,
원문정보
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To ensure the reliability of high-power light-emitting diode (LED) bulbs, temperature management is very important, including reduction of the junction temperature on the LED chip and enhancing outward thermal dissipation. Simulation can be an effective tool for predicting the temperature distribution over all bulbs, which enables a quantitative analysis. In this study, we investigated a high-power LED bulb consisting of 21 LED packages with a single LED chip for each. We experimentally measured the temperature at the surface of the LED bulb using a thermocouple, and a finite volume method (FVM) simulation was conducted for the same position to confirm the accuracy of the prediction model. In addition, thermal equilibrium models based on heat transfer equations are proposed for quantitative analyses using calculations based on the models. Using this method, we explain the effect of the lens on the surface temperatures of the LED bulb and predict the junction temperature. By comparing the analysis of the heat dissipation characteristics from the calculations to the thermal equilibrium models, we determined the accuracy of the FVM simulation in this study for the variation in thermal conductivity of the heat sink. Based on the reliability of the FVM simulation, we investigated the effects of the surface emissivity of the heat sink and heat convection conditions.