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저융점합금 라인을 이용한 플렉시블 OLED 봉지
출처
대한금속.재료학회
발행일
2019-04-08
분야분류
IT소재부품, 해외동향, 전자정보디바이스, LED, IT부품정보, IT부품정보 네트워크, 부품, GreenIT,
원문정보
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We have developed an encapsulation technology for OLED devices using an LMPA sealing line to enhance barrier characteristics against moisture and oxygen penetration. To verify the potential of this technology for flexible OLED devices, three experimental factors were investigated in this study. First, the stability of the sealing line on the flexible substrate after repetitive bending was investigated by measuring changes in line resistivity. Secondly, temperature evolution and distribution on the flexible substrate during thermal processes were investigated. Thirdly, an OLED sample with the edge sealing line was manufactured and the lifetime was compared with a reference sample. The results showed the potential value of the LMPA sealing line to enhance the reliability and lifetime of flexible OLED devices.